The 13th Japan-Korea Joint Workshop on Materials Science
Scope
“The 13th Japan-Korea Joint Workshop on Materials Science” is continued after a series of successful workshops started in 2002 in the occasion of MOU between University of Tsukuba and Pusan National University. The 13th Workshop will take place at University of Tsukuba, Japan, in August 29, 2013. This joint workshop delivers the opportunity to share knowledge and state-of-the-art advancements in materials science.
We are looking forward to meeting you at Tsukuba.
Invited Speakers
Yong Suk Yang, Pusan National University (Korea)
Yoon Hwae Hwang, Pusan National University (Korea)
Chul Hong Park, Pusan National University (Korea)
Hyun Tak Kim, ETRI (Korea)
Jae Hyeon Ko, Hallym University (Korea)
In Sung Park, Hanyang Univesity (Korea)
Kiyoto Matsuishi, University of Tsukuba (Japan)
Miwako Takahashi, University of Tsukuba (Japan)
Hiroshi Abe, Defence Academy (Japan)
Shinya Tsukada, Shimane University (Japan)
Workshop chairs
Kenichi Ohshima (University of Tsukuba)
Yoon Hwae Hwang (Pusan National University )
Organizing Committee
Yong Suk Yang (Pusan National University)
Yoon Hwae Hwang (Pusan National University)
Chul Hong Park (Pusan National University)
Seiji Kojima (University of Tsukuba)
Kiyoto Matsuishi (University of Tsukuba)
Miwako Takahashi (University of Tsukuba)
Contact
Kenichi Ohshima, Seiji Kojima
E-mail; ohshima[at]bk.tsukuba.ac.jp, kojima [at] ims.tsukuba.ac.jp
With the sponsorship of University of Tsukuba
Date
August 29, 2013
Venue
University of Tsukuba (Daigakukaikan Conference Room), Tsukuba, Japan
Program
Registration
Abstract and Proceedings
Abstract submission (deadline: July 31, 2013) is closed.
TICMS2013 proceeding will be electronically published in a category of
IOP Conference Series: Materials Science and Engineering by IOP Publishing.
All invited and recommended speakers can submit a paper to the proceedings.
The maximum length of the manuscript is 8 pages for the invited speakers, and 6 pages for
the recommended speakers, respectively. Detailed information for authors is available in
http://conferenceseries.iop.org/content/authors
